[IEEE 2016 IEEE CPMT Symposium Japan (ICSJ) - Kyoto, Japan (2016.11.7-2016.11.9)] 2016 IEEE CPMT Symposium Japan (ICSJ) - Virtual prototyping methodology for assessment of the interaction between wire bond pad design and bond process parameters to enhance the robustness of copper wire bond interconnect

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.