Solder joint reliability in AgPt‐metallized LTCC modules

Soldering & Surface Mount Technology 2005 / 09 Vol. 17; Iss. 3

Solder joint reliability in AgPt‐metallized LTCC modules

Nousiaianen, Olli, Rautioaho, Risto, Kautio, Kari, Jääskeläinen, Jussi, Leppävuori, Seppo
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
17
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910510613538
Date:
September, 2005
File:
PDF, 557 KB
english, 2005
Conversion to is in progress
Conversion to is failed