[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Simultaneous fabrication of a through-glass interconnect via and bumps using dry filling process of submicron gold particles
Nomura, Kazuya, Okada, Akiko, Shoji, Shuichi, Ogashiwa, Toshinori, Mizuno, JunYear:
2016
Language:
english
DOI:
10.1109/IMPACT.2016.7799988
File:
PDF, 1.06 MB
english, 2016