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[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - One-time deformable thermoplastic devices based on flexible circuit board technology
Plovie, Bart, Yang, Yang, Guillaume, Joren, Dunphy, Sheila, Dhaenens, Kristof, Van Put, Steven, Vervust, Thomas, Bossuyt, Frederick, Vanfleteren, JanYear:
2016
Language:
english
DOI:
10.1109/IMPACT.2016.7799996
File:
PDF, 954 KB
english, 2016