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[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - The reaction mechanism of cupric oxide reduction under hydrogen plasma treatment for epoxy molding compound / lead-frames adhesion improve
Shu, Min-Fong, Yang, Bret, Liu, Webber, Tseng, Yi-HsiuYear:
2016
Language:
english
DOI:
10.1109/IMPACT.2016.7800007
File:
PDF, 1.20 MB
english, 2016