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[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Performance analyses on an advanced high-power diode packaging structures
Lu, Yong-Cheng, Huang, Kuo-Hsin, Lwo, Ben-Je, Kao, Jeff, Lee, Robert, Chung, Harrison, Huang, Tzu-YenYear:
2016
Language:
english
DOI:
10.1109/IMPACT.2016.7800010
File:
PDF, 1021 KB
english, 2016