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[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Flex circuit depaneling in thin film polymer using dry etching technology
Lin, Jim-Wein, Liu, De-Shiang, Lin, Chen-Hao, Wang, Chih-Lun, Chen, Jui-Tang, Wang, Cheng-Hsiung, Kuo, Chi-Hai, Yang, Kai-Ming, Hung, Yin-Po, Ko, Cheng-Ta, Chen, Yu-HuaYear:
2016
Language:
english
DOI:
10.1109/IMPACT.2016.7800035
File:
PDF, 1.03 MB
english, 2016