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[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Optimized design of through-hole via in high-speed printed circuit board
Sie, Kun-Lin, Wang, Wei, Jou, Jau-Ji, Shih, Tien-TsorngYear:
2016
Language:
english
DOI:
10.1109/IMPACT.2016.7800036
File:
PDF, 1.07 MB
english, 2016