![](/img/cover-not-exists.png)
[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Design of printed circuit board with separate heat metal block for high-speed optical transceiver module
Chiu, Chun-Lin, Wang, Ruei-Nian, Jou, Jau-Ji, Shih, Tien-TsorngYear:
2016
Language:
english
DOI:
10.1109/IMPACT.2016.7800037
File:
PDF, 1.09 MB
english, 2016