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[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Study on a formulated no clean flux for fine-pitch flip chip package of copper pillar/microbump interconnect
Chen, Hsiang-Chuan, Chuang, Ya-Ching, Chang, Chia-Hao, Tseng, WatsonYear:
2016
Language:
english
DOI:
10.1109/IMPACT.2016.7800059
File:
PDF, 1.13 MB
english, 2016