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[IEEE 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2016.10.26-2016.10.28)] 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Chip package interaction development of flip chip CSP package with Cu pillar bump on lead for advanced node chip
Wu, Chung Yen, Wang, Cheng Hsiao, Ho, Kai Kuang, Chen, Kuo Ming, Kuo, Po Chen, Yang, Ching LiYear:
2016
Language:
english
DOI:
10.1109/IMPACT.2016.7800074
File:
PDF, 1.26 MB
english, 2016