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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Electroless and Electrolytic Copper Plating of Glass Interposer Combined with Metal Oxide Adhesion Layer for Manufacturing 3D RF Devices
Liu, Zhiming, Fu, Hailuo, Hunegnaw, Sara, Wang, Jun, Merschky, Michael, Magaya, Tafadzwa, Mieno, Akira, Shorey, Aric, Kuramochi, Satoru, Akazawa, Miyuki, Yun, HobieYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.230
File:
PDF, 612 KB
english, 2016