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[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Effects of thermal aging and electromigration on tensile strength of SnAgCu solder joints with different volume
Wang, Gang, Yin, Li-Meng, Yao, Zong-Xiang, Wang, Jin-ZhaoYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583240
File:
PDF, 652 KB
english, 2016