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[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Identification of key factors to reduce stress induced during 3D IC's assembly
Lofrano, Melina, Gonzalez, Mario, Cherman, VladimirYear:
2016
Language:
english
DOI:
10.1109/ESTC.2016.7764699
File:
PDF, 961 KB
english, 2016