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[IEEE 2016 11th International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM) - Smolenice, Slovakia (2016.11.13-2016.11.16)] 2016 11th International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM) - 3-D device and circuit electrothermal simulations of power integrated circuit including package
Chvala, Ales, Benko, Peter, Pribytny, Patrik, Marek, Juraj, Donoval, DanielYear:
2016
Language:
english
DOI:
10.1109/ASDAM.2016.7805921
File:
PDF, 515 KB
english, 2016