An Integrated Approach for Via Metallization in Microwave...

IEEE Transactions on Components Packaging and Manufacturing Technology 2017 / 1 Vol. 7; Iss. 1

An Integrated Approach for Via Metallization in Microwave Substrates

Bhat, Shriram N., Varghese, Jissy, Sharma, S. Venkateshwara
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Volume:
7
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2016.2624760
Date:
January, 2017
File:
PDF, 3.50 MB
english, 2017
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