Comparison of HF and HCl cross-contamination between...

Microelectronic Engineering 2017 / 02 Vol. 169

Comparison of HF and HCl cross-contamination between different ENTEGRIS FOUP platforms and Cu-coated wafers

Herrán, Fernando, González-Aguirre, Paola, Beitia, Carlos, Ohlsen, Jim, Lundgren, Jorgen, Fontaine, Hervé
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Volume:
169
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2016.11.017
Date:
February, 2017
File:
PDF, 630 KB
english, 2017
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