Optimization of residual stress of SiO2/organic silicon...

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Surface and Coatings Technology 2016 / 12

Optimization of residual stress of SiO2/organic silicon stacked layer prepared using inductively coupled plasma deposition

Hsu, Chia-Hsun, Cho, Yun-Shao, Liu, Ting-Xuan, Chang, Hsi-Wei, Lien, Shui-Yang
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Language:
english
Journal:
Surface and Coatings Technology
DOI:
10.1016/j.surfcoat.2016.12.107
Date:
December, 2016
File:
PDF, 1.86 MB
english, 2016
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