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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Effect of High Tg Mold Compound on MEMS Sensor Package Performance
Kim, Yeonsung, Sengupta, Dipak, Dufort, Benoit, Liu, Dapeng, Zylinski, MichaelYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.190
File:
PDF, 289 KB
english, 2016