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[IEEE 2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Burlingame, CA, USA (2016.10.10-2016.10.13)] 2016 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Monolithic 3D IC vs. TSV-based 3D IC in 14nm FinFET technology
Samal, Sandeep Kumar, Nayak, Deepak, Ichihashi, Motoi, Banna, Srinivasa, Lim, Sung KyuYear:
2016
Language:
english
DOI:
10.1109/S3S.2016.7804405
File:
PDF, 600 KB
english, 2016