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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Low Temperature Cu Nanorod/Sn/Cu Nanorod Bonding Technology for 3D Integration
Du, Li, Shi, Tielin, Tang, Zirong, Shen, Junjie, Liao, GuanglanYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.32
File:
PDF, 1.28 MB
english, 2016