Fast Nonlinear Dynamic Compact Thermal Modeling With...

IEEE Transactions on Components Packaging and Manufacturing Technology 2017 / 1 Vol. 7; Iss. 1

Fast Nonlinear Dynamic Compact Thermal Modeling With Multiple Heat Sources in Ultra-Thin Chip Stacking Technology

Codecasa, Lorenzo, d'Alessandro, Vincenzo, Magnani, Alessandro, Rinaldi, Niccolo
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Volume:
7
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2016.2623420
Date:
January, 2017
File:
PDF, 2.39 MB
english, 2017
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