Examinations of Selected Thermal Properties of Packages of...

Metrology and Measurement Systems 2016 / 01 Vol. 23; Iss. 3

Examinations of Selected Thermal Properties of Packages of SiC Schottky Diodes

Bisewski, Damian, Myśliwiec, Marcin, Górecki, Krzysztof, Kisiel, Ryszard, Zarębski, Janusz
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Volume:
23
Language:
english
Journal:
Metrology and Measurement Systems
DOI:
10.1515/mms-2016-0033
Date:
January, 2016
File:
PDF, 1.05 MB
english, 2016
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