Novel Surface Impedance Modeling for Broadband Parameter...

IEEE Microwave and Wireless Components Letters 2017 / 1 Vol. 27; Iss. 1

Novel Surface Impedance Modeling for Broadband Parameter Extraction of 3-D Interconnects

Zhao, Yu, Ling, Feng, Mao, Junfa
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Volume:
27
Language:
english
Journal:
IEEE Microwave and Wireless Components Letters
DOI:
10.1109/LMWC.2016.2630842
Date:
January, 2017
File:
PDF, 594 KB
english, 2017
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