TiN diffusion barrier failure by the formation of Cu...

TiN diffusion barrier failure by the formation of Cu 3 Si investigated by electron microscopy and atom probe tomography

Mühlbacher, Marlene, Greczynski, Grzegorz, Sartory, Bernhard, Mendez-Martin, Francisca, Schalk, Nina, Lu, Jun, Hultman, Lars, Mitterer, Christian
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Volume:
34
Language:
english
Journal:
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
DOI:
10.1116/1.4942003
Date:
March, 2016
File:
PDF, 5.61 MB
english, 2016
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