Time-Domain Analysis of Noise Coupling Between Package and...

IEEE Transactions on Components Packaging and Manufacturing Technology 2017 / 2 Vol. 7; Iss. 2

Time-Domain Analysis of Noise Coupling Between Package and PCB Power/Ground Planes Based on WLP-FDTD

Tan, Xin, Li, Xiao-Chun, Mao, Junfa
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Volume:
7
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2016.2628050
Date:
February, 2017
File:
PDF, 1.01 MB
english, 2017
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