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[IEEE 2016 12th International Congress Molded Interconnect Devices (MID) - Wuerzburg, Germany (2016.9.28-2016.9.29)] 2016 12th International Congress Molded Interconnect Devices (MID) - Modelization and characterization of 2D and 3D mid inductors for multidirectional inductive proximity sensing
Kamotesov, Sergkei, Lombard, Philippe, Vollaire, Christian, Semet, Vincent, Cabrera, Michel, Dahmani, Rabah, Veille, Amaury, Moguedet, MaëlYear:
2016
Language:
english
DOI:
10.1109/icmid.2016.7738936
File:
PDF, 559 KB
english, 2016