[IEEE 2016 IEEE 37th International Electronics...

[IEEE 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference - Georgetown, Penang, Malaysia (2016.9.20-2016.9.22)] 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference - Elimination mold flash by mold design enhancement and leadframe process control on flat power package

Ting, Kow Siew, a.l. Nanta Kumar, Vinod Kumar

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Year:

2016

Language:

english

DOI:

10.1109/IEMT.2016.7761941

File:

PDF, 343 KB

english, 2016

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