[IEEE 2016 International Conference on Communication and Signal Processing (ICCSP) - Melmaruvathur, Tamilnadu, India (2016.4.6-2016.4.8)] 2016 International Conference on Communication and Signal Processing (ICCSP) - PCB solder pad inspection mechanism using gerber file
Raghuvanshi, Vediya, Burman, Aparajita, Bartakke, P. P., Deshpande, SatishYear:
2016
Language:
english
DOI:
10.1109/iccsp.2016.7754367
File:
PDF, 292 KB
english, 2016