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Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 °C Cu–Cu Wafer on Wafer Thermocompression Bonding
Panigrahi, Asisa Kumar, Ghosh, Tamal, Vanjari, Siva Rama Krishna, Singh, Shiv GovindVolume:
64
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2017.2653188
Date:
March, 2017
File:
PDF, 2.13 MB
english, 2017