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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Eternal Packages: Liquid Metal Flip Chip Devices
Ndieguene, Assane, Albert, Pierre, Fortin, Clement, Oberson, Valerie, Sylvestre, JulienYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.29
File:
PDF, 869 KB
english, 2016