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SPIE Proceedings [SPIE The International Conference on Micro- and Nano-Electronics 2016 - Zvenigorod, Russian Federation (Monday 3 October 2016)] International Conference on Micro- and Nano-Electronics 2016 - Tungsten alloyed with rhenium as an advanced material for heat-resistant silicon ICs interconnects
Lukichev, Vladimir F., Rudenko, Konstantin V., Belov, A. N., Chaplygin, Yu. A., Golishnikov, A. A., Kostyukov, D. A., Putrya, M. G., Safonov, S. O., Shevyakov, V. I.Volume:
10224
Year:
2016
Language:
english
DOI:
10.1117/12.2264789
File:
PDF, 381 KB
english, 2016