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[IEEE 2016 IEEE International Symposium on Electromagnetic Compatibility - EMC 2016 - Ottawa, ON, Canada (2016.7.25-2016.7.29)] 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Validating the transmission-line based material property extraction procedure including surface roughness for multilayer PCBs using simulations
Jin, Shuai, Fang, Xiang, Chen, Bichen, Gao, Han, Ye, Xiaoning, Fan, JunYear:
2016
Language:
english
DOI:
10.1109/isemc.2016.7571694
File:
PDF, 523 KB
english, 2016