AIP Conference Proceedings [AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: 11th International Workshop - Bad Schandau, (Germany) (12–14 April 2010)] - Application Of Ti-Based Self-Formation Barrier Layers To Cu Dual-Damascene Interconnects

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.