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AIP Conference Proceedings [AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: 11th International Workshop - Bad Schandau, (Germany) (12–14 April 2010)] - Application Of Ti-Based Self-Formation Barrier Layers To Cu Dual-Damascene Interconnects
Ito, Kazuhiro, Ohmori, Kazuyuki, Kohama, Kazuyuki, Mori, Kenichi, Maekawa, Kazuyoshi, Asai, Koyu, Murakami, Masanori, Zschech, Ehrenfried, Ogawa, Shinichi, Ho, Paul S.Year:
2010
Language:
english
DOI:
10.1063/1.3527142
File:
PDF, 2.77 MB
english, 2010