Three-Dimensional Versus Two-Dimensional Finite Element...

Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Yao, Q., Qu, J.
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Volume:
121
Year:
1999
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792684
File:
PDF, 719 KB
english, 1999
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