Flow Boiling in Microgaps for Thermal Management of High...

Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems

Han, Xuefei, Fedorov, Andrei, Joshi, Yogendra
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Volume:
138
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4034317
Date:
August, 2016
File:
PDF, 3.21 MB
english, 2016
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