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Effect of Solder Joint Thickness on Intermetallic Compound Growth Rate of Cu/Sn/Cu Solder Joints During Thermal Aging
Zhu, Yan, Sun, FenglianVolume:
138
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4034819
Date:
October, 2016
File:
PDF, 1.35 MB
english, 2016