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[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing
Liang, Shui-Bao, Ke, Chang-Bo, Ma, Wen-Jing, Zhou, Min-Bo, Zhang, Xin-PingYear:
2016
Language:
english
DOI:
10.1109/ectc.2016.398
File:
PDF, 2.38 MB
english, 2016