Electromigration anisotropy introduced by tin orientation...

Journal of Alloys and Compounds 2017 / 05 Vol. 703

Electromigration anisotropy introduced by tin orientation in solder joints

Chen, Jian-Qiang, Liu, Kai-Lang, Guo, Jing-Dong, Ma, Hui-Cai, Wei, Song, Shang, Jian-Ku
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Volume:
703
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2017.01.346
Date:
May, 2017
File:
PDF, 1.50 MB
english, 2017
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