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[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature
Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, OsamuYear:
2005
Language:
english
DOI:
10.1115/ipack2005-73152
File:
PDF, 5.94 MB
english, 2005