Tight Focus Toward the Future: Tight Material Combination for Millimeter-Wave RF Power Applications: InP HBT SiGe BiCMOS Heterogeneous Wafer-Level Integration
Weimann, Nils, Hossain, Maruf, Krozer, Viktor, Heinrich, Wolfgang, Lisker, Marco, Mai, Andreas, Tillack, BerndVolume:
18
Language:
english
Journal:
IEEE Microwave Magazine
DOI:
10.1109/MMM.2016.2635859
Date:
March, 2017
File:
PDF, 1.98 MB
english, 2017