Experimental and Analytical Studies of 28-Pin Thin Small...

Journal of Electronic Packaging 1992 Vol. 114; Iss. 2

Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability

Lau, J., Golwalkar, S., Erasmus, S., Surratt, R., Boysan, P.
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Volume:
114
Year:
1992
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2906414
File:
PDF, 1.43 MB
english, 1992
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