A Study on Electrical Reliability Criterion on Through Silicon Via Packaging
Lwo, Ben-Je, Tseng, Kuo-Hao, Tseng, Kun-FuVolume:
138
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4032932
Date:
March, 2016
File:
PDF, 691 KB
english, 2016