[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Heat Spreading Analysis of a Heat Sink Base Embedded With a Heat Pipe
Borgmeyer, Brian V., Ma, H. B.Year:
2005
Language:
english
DOI:
10.1115/ipack2005-73393
File:
PDF, 142 KB
english, 2005