[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Electromigration simulation of Cu pillar interconnect microstructure of 3D packaging
Leng, Zhiyuan, Xiao, Ming, He, Man, Xia, Weisheng, Wang, BoYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583126
File:
PDF, 1.36 MB
english, 2016