[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Electroplating fabrication and characterization of Sn-Ag-Cu eutectic solder films
Xie, Jin-Qi, Zhong, Zhe, Zhang, Kai, Yuen, Matthew M.F., Lee, S.W. Ricky, Fu, Xian-Zhu, Sun, Rong, Wong, Ching-PingYear:
2016
Language:
english
DOI:
10.1109/icept.2016.7583144
File:
PDF, 619 KB
english, 2016