TSV-based 3D ICs: Design Methods and Tools

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IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2017

TSV-based 3D ICs: Design Methods and Tools

Lu, Tiantao, Serafy, Caleb, Yang, Zhiyuan, Samal, Sandeep, Lim, Sung Kyu, Srivastava, Ankur
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Year:
2017
Language:
english
Journal:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
DOI:
10.1109/TCAD.2017.2666604
File:
PDF, 7.21 MB
english, 2017
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