A Procedure for Automated Shape and Life Prediction in...

A Procedure for Automated Shape and Life Prediction in Flip-Chip and BGA Solder Joints

Subbarayan, G.
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Volume:
118
Year:
1996
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792142
File:
PDF, 788 KB
english, 1996
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