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Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module
Beckermann, C., Smith, T. F., Pospichal, B.Volume:
116
Year:
1994
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2905500
File:
PDF, 904 KB
english, 1994