[ASME ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference - Vancouver, British Columbia, Canada (July 8–12, 2007)] ASME 2007 InterPACK Conference, Volume 1 - Reliability of Indium Solder for Cold Temperature Packaging
Wu, Rui, McCluskey, F. PatrickYear:
2007
Language:
english
DOI:
10.1115/ipack2007-33456
File:
PDF, 123 KB
english, 2007